First Place Machinery

 

ASM MS899-DL Wafer Mapping Die Sorter

Machine is in like new condition!

Serial Number: MS899DL-01817-0402
Model Number: MS899-DL
Year 2008 August
Cycle Time: 175 ms
XY Placement: +/- 1.5 mil
Die Rotation: +/- 3 degrees
Collect type: Surface pick type
Pick/Bond Force: 40 - 250 g (adjustable)
Bin frame capability: Max 150
100 - buffer bin cassette
25 - empty bin cassette
25 - finished bin cassette
Bin Frame Size: 175 mm (I.D) / 195 (O.D)
Effective binning area: 58 x 58 mm2
Size of Mylar sheet: 195 x 195 mm2
Wafer loader capacity: Dscio Ring 25 / Foton Ring 12
Package Size Handling w/look ahead: 240 x 240 mil2
Package Size Handling w/o look ahead: 480 x 480 mil2
Power Requirements: 110 Volt - 50/60 HZ
Dimensions: 1448 mm x 1486 mm x 1626 mm
Weight: 100 kg
 
Location: Boston, MA
 
Price: $ 45,000

ASM Die Sorter

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