Fineplacer Sub Micron Bonder

Item is in New Condition

Purchased for $150,000+ and never set up

Equipment Description

• Finetech Fineplacer
• Type: Sub Micron Bonding System Flip Chip Bonder
• Model Number: FD3.1
• Serial Number: B192861
• Advanced Micro Assembly
• Optical Packaging
• Flip Chip
• Accuracy Better Than 0.5 to 1.0 micrometers
• Bonding Force 0.1 N to 200 N
• Maximum Heat up to 400F
• Vision Alignment
• X,Y Stage
• Power: 220 volts - 50/60 HZ - 1 Phase
• CE Marked
• Location: Boston, MA

Price: $60,000

Fineplacer Lambda FD3 Bonder

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